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Plasma Semiconductor Processing Seals

 

Process Environment Suggested Product
HDPCVD/PECVD/ALD Kalrez® 9100
SACVD/Ash/Strip Kalrez® 9500
Dielectric (Oxide) Etch Kalrez® 9300
Conductor (Poly) Etch Kalrez® 9500

Kalrez® 9100

Features/Benefits

  • Low erosion rate and ultra-low particle generation in oxygen and fluorine-based plasmas
  • Excellent resistance to dry process chemistry
  • Excellent thermal stability
  • Very low outgassing properties and metals content
  • Excellent elastic recovery and low compression set properties

Suggested Applications

  • Gas inlet/orifice seals
  • Chamber lid seals • Isolation valve seals
  •  “Select” bonded gate valves/slit valve door seals*

Kalrez® 9300

Features/Benefits

  • Low erosion rate and ultra-low particle generation in ion/radical dominant oxygen and fluorine-based plasmas
  • Excellent resistance to etch process chemistry
  • Very low metals content
  • Excellent thermal stability
  • Excellent mechanical strength

Suggested Applications

  • Gas inlet/orifice seals
  • Chamber lid seals
  • Isolation valve seals
  • Bonded gate valves/slit valve door seals

Kalrez® 9500

Features/Benefits

  • Excellent resistance to CVD and ash/strip process chemistry (ozone, ammonia, water vapor, etc.)
  • Low erosion rate and ultra-low particle generation in radical dominant oxygen and fluorine-based plasmas
  • Excellent thermal stability
  • Very low outgassing and metals content
  • Excellent mechanical strength

Suggested Applications

  • Gas inlet/orifice/mixing block seals
  • Chamber lid seals • Isolation valve seals
  • Bonded gate valves/slit valve door seals